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India's 1st 3D Chip Packaging Plant Approved Under ISM: ₹1,934 Cr Investment in Odisha to Produce 70,000 Glass Panels Annually

Target:UPSC GS-IIIMPSCSSC GATeachingPrelims HighMains MediumStatic GK Link
19 Apr 2026
~2 min
Source: Indian Express
Key Data:₹1,934 crore70,000 glass panels annually50 million assembled units2,500 jobs
Bodies:India Semiconductor Mission (ISM)Ministry of Electronics and IT
Practice MCQs from today's news ▸
What This Article Covers

1.Foundation stone laid for India's first 3D chip packaging plant in Bhubaneswar, Odisha, by CM Mohan Charan Majhi and Union IT Minister Ashwini Vaishnaw.

2.The ₹1,934 crore project, approved under the India Semiconductor Mission (ISM), is being implemented by US-based 3D Glass Solutions Inc via its Indian subsidiary and funded by Intel among others.

3.The plant signifies Odisha's diversification into high-tech industries like electronics and IT, aiming to produce 70,000 glass panels and 50 million assembled units annually, generating 2,500 jobs.

The Big Picture
Prelims · HighMains · Medium

India's semiconductor ambitions get a major boost with the foundation stone laid for the nation's first advanced 3D chip packaging facility in Bhubaneswar, Odisha. Approved under the India Semiconductor Mission (ISM) with ₹1,934 crore investment, this plant marks a strategic shift towards high-tech manufacturing in the state, moving beyond traditional industries like mining and metals.

Exam Lens

Quick Exam Facts From News

Project Investment₹1,934 crore
Annual Production Target70,000 glass panels & 50 million assembled units
Jobs Expected2,500 (direct & indirect)
Approving AuthorityIndia Semiconductor Mission (ISM)

1-Minute Revision

  • ›Project Investment: ₹1,934 crore
  • ›Annual Production Target: 70,000 glass panels & 50 million assembled units
  • ›Target this Data: ₹1,934 crore investment and 70,000 glass panels annual production target.
  • ›Target this Nodal Body: India Semiconductor Mission (ISM) - the approving authority.
  • ›Target this Location: Bhubaneswar, Odisha - for state-specific questions.

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Practice exam-style questions, track your score, and strengthen your recall.

Q1Static LinkageEasy

The 3D chip packaging plant in Odisha received approval under which government mission?

Q2Statement-basedHard

Consider the following statements regarding India's first 3D chip packaging plant:

1. It is being implemented by a US-based company through its Indian subsidiary.

2. The plant will use traditional silicon substrates for chip packaging.

3. The project is expected to generate around 2,500 direct and indirect jobs.

Which of the statements given above is/are correct?

Q3Data-centricMedium

What is the total project cost (in ₹ crore) of India's first 3D chip packaging plant in Odisha, as mentioned in the news?

Q4Application/ImpactMedium

What is a key strategic significance of establishing the 3D chip packaging plant in Odisha, as highlighted in the news?

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