India's semiconductor ambitions get a major boost with the foundation stone laid for the nation's first advanced 3D chip packaging facility in Bhubaneswar, Odisha. Approved under the India Semiconductor Mission (ISM) with ₹1,934 crore investment, this plant marks a strategic shift towards high-tech manufacturing in the state, moving beyond traditional industries like mining and metals.
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- ›Project Investment: ₹1,934 crore
- ›Annual Production Target: 70,000 glass panels & 50 million assembled units
- ›Target this Data: ₹1,934 crore investment and 70,000 glass panels annual production target.
- ›Target this Nodal Body: India Semiconductor Mission (ISM) - the approving authority.
- ›Target this Location: Bhubaneswar, Odisha - for state-specific questions.
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