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₹1,27,500 Cr Semicon 2.0 Notified: 40% Silicon Fab Subsidy, 35% ATMP Incentives

Target:UPSC GS-IIIMPSCSSC GATeachingBankingPrelims HighMains MediumStatic GK Link
31 Aug 2026
~2 min
Source: The Hindu
Key Data:₹1,27,500 crore40% fiscal support for silicon fabs35% for compound/display/specialised fabs35% capex for advanced packaging25% capex for conventional packagingCabinet approval: July 15, 2026
Bodies:Union Cabinet
Practice MCQs from today's news ▸
What This Article Covers

1.The Union Cabinet approved Semicon 2.0 on July 15, 2026; notification was issued on August 31, 2026 with detailed eligibility and incentive structure.

2.Fiscal support: 40% for silicon fabs, 35% for compound/display/specialised fabs; capex incentives: 35% for advanced ATMP packaging, 25% for conventional packaging.

3.Startups can access grant + equity co-investment; companies get royalty financing or equity co-investment – a key distinction for exam MCQs.

The Big Picture
Prelims · HighMains · Medium

The government has notified the ₹1,27,500 crore Semicon 2.0 scheme, a major push to build India's semiconductor ecosystem from chip manufacturing to design and packaging. With tiered fiscal support – 40% for silicon fabs, 35% for compound/display fabs and advanced packaging – the scheme aims to achieve self-reliance and attract global players. For students, this is a high-priority policy with clear Prelims data points and Mains implications for Atmanirbhar Bharat and industrial strategy.

Exam Lens

Quick Exam Facts From News

Scheme NameSemicon 2.0
Total Outlay₹1,27,500 crore
Cabinet Approval DateJuly 15, 2026
Notification DateAugust 31, 2026
Silicon Fab Support40% fiscal support
Compound/Display Fab Support35% fiscal support
Advanced ATMP Capex Incentive35% of capex
Conventional Packaging Incentive25% of capex
Eligibility for StartupsGrant + equity co-investment
Eligibility for CompaniesRoyalty financing or equity co-investment

1-Minute Revision

  • ›Scheme Name: Semicon 2.0
  • ›Total Outlay: ₹1,27,500 crore
  • ›Target this Data: ₹1,27,500 crore outlay; 40% silicon fab support; 35% compound/display fab support; 35% advanced ATMP capex; 25% conventional packaging.
  • ›Target this Nodal Body: Union Cabinet (approved the scheme); Ministry of Electronics and Information Technology (MeitY) – IT Secretary S. Krishnan represented the government.
  • ›Target this Date: Cabinet approval on July 15, 2026; Notification on August 31, 2026.

Mastered this topic? Test your knowledge with a full MCQ quiz.

Practice exam-style questions, track your score, and strengthen your recall.

Q1Static LinkageEasy

Which constitutional body approved the Semicon 2.0 scheme?

Q2Statement-basedHard

Consider the following statements:

1. Semicon 2.0 provides 40% fiscal support for silicon fabs.

2. Startups receive financial support only in the form of grant.

3. The scheme was notified on August 31, 2026.

Which of the statements given above is/are correct?

Q3Data-centricMedium

What percentage of capex incentive is provided for advanced packaging (ATMP) under Semicon 2.0?

Q4Application/ImpactMedium

What is the primary objective of the Semicon 2.0 scheme as stated in the news?

All 15 MCQs ▸
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