The government has notified the ₹1,27,500 crore Semicon 2.0 scheme, a major push to build India's semiconductor ecosystem from chip manufacturing to design and packaging. With tiered fiscal support – 40% for silicon fabs, 35% for compound/display fabs and advanced packaging – the scheme aims to achieve self-reliance and attract global players. For students, this is a high-priority policy with clear Prelims data points and Mains implications for Atmanirbhar Bharat and industrial strategy.
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- ›Scheme Name: Semicon 2.0
- ›Total Outlay: ₹1,27,500 crore
- ›Target this Data: ₹1,27,500 crore outlay; 40% silicon fab support; 35% compound/display fab support; 35% advanced ATMP capex; 25% conventional packaging.
- ›Target this Nodal Body: Union Cabinet (approved the scheme); Ministry of Electronics and Information Technology (MeitY) – IT Secretary S. Krishnan represented the government.
- ›Target this Date: Cabinet approval on July 15, 2026; Notification on August 31, 2026.
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