India's first advanced 3D glass chip packaging facility, approved under the ₹76,000 crore India Semiconductor Mission (ISM), is being established in Bhubaneswar. This strategic project, led by US-based 3D Glass Solutions with investments from Intel and Lockheed Martin, aims to position India at the cutting edge of semiconductor packaging technology, crucial for AI, 5G, and defense applications, and move beyond traditional Moore's Law limitations.
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- ›Project Cost: ₹1,934 crore
- ›Parent Scheme Outlay: ₹76,000 crore (India Semiconductor Mission)
- ›Target this Data: ₹1,934 crore (project cost) and ₹76,000 crore (ISM outlay).
- ›Target this Nodal Body: India Semiconductor Mission (ISM) under the Ministry of Electronics and Information Technology (MeitY).
- ›Target this Location: Bhubaneswar, Odisha.
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