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India's First Advanced 3D Chip Packaging Unit Approved in Odisha Under ₹1,934 Cr India Semiconductor Mission

Target:UPSC GS-IIIMPSCSSC GATeachingPrelims HighMains MediumStatic GK Link
20 Apr 2026
~2 min
Source: Indian Express
Key Data:₹1,934 crore₹76,000 crore70,000 glass panels annually50 million assembled units annually2,500 jobs10 projects
Bodies:India Semiconductor Mission (ISM)
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What This Article Covers

1.India lays foundation for its first advanced 3D glass chip packaging facility in Bhubaneswar, Odisha, with a project cost of ₹1,934 crore under the ₹76,000 crore India Semiconductor Mission (ISM).

2.The facility, led by US-based 3D Glass Solutions, will produce glass substrates and 3D Heterogeneous Integration (3DHI) modules, representing novel technology that could help 'beat Moore's Law' in semiconductors.

3.This is one of ten projects approved under ISM and is expected to produce 70,000 glass panels and 50 million assembled units annually, generating 2,500 jobs, as part of India's push to build a full-stack chip ecosystem.

The Big Picture
Prelims · HighMains · Medium

India's first advanced 3D glass chip packaging facility, approved under the ₹76,000 crore India Semiconductor Mission (ISM), is being established in Bhubaneswar. This strategic project, led by US-based 3D Glass Solutions with investments from Intel and Lockheed Martin, aims to position India at the cutting edge of semiconductor packaging technology, crucial for AI, 5G, and defense applications, and move beyond traditional Moore's Law limitations.

Exam Lens

Quick Exam Facts From News

Project Cost₹1,934 crore
Parent Scheme Outlay₹76,000 crore (India Semiconductor Mission)
Annual Production Target70,000 glass panels & 50 million assembled units
Expected Jobs2,500 (direct & indirect)
Number of ISM-Approved Projects10 projects
Total Investment DrawnOver ₹1.6 lakh crore
LocationBhubaneswar, Odisha

1-Minute Revision

  • ›Project Cost: ₹1,934 crore
  • ›Parent Scheme Outlay: ₹76,000 crore (India Semiconductor Mission)
  • ›Target this Data: ₹1,934 crore (project cost) and ₹76,000 crore (ISM outlay).
  • ›Target this Nodal Body: India Semiconductor Mission (ISM) under the Ministry of Electronics and Information Technology (MeitY).
  • ›Target this Location: Bhubaneswar, Odisha.

Mastered this topic? Test your knowledge with a full MCQ quiz.

Practice exam-style questions, track your score, and strengthen your recall.

Q1Static LinkageEasy

Under which major government initiative has the 3D glass chip packaging facility in Odisha been approved?

Q2Statement-basedHard

Consider the following statements regarding the 3D glass chip packaging facility in Odisha:

1. It is India's first advanced 3D chip packaging unit and has been approved under the India Semiconductor Mission.

2. The project is expected to produce 1 lakh glass panels and 10 million assembled units annually.

3. The technology aims to overcome limitations posed by Moore's Law through vertical integration of chip components.

Which of the statements given above is/are correct?

Q3Data-centricMedium

What is the total financial outlay of the India Semiconductor Mission (ISM) under which the 3D glass packaging project was approved?

Q4Application/ImpactMedium

What is a key strategic advantage of the 3D glass chip packaging technology being set up in Odisha?

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