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₹1.27 Lakh Crore India Semiconductor Mission 2.0 Approved: Focus on Supply Chain, R&D and Design

Target:UPSC GS-IIIMPSCSSC GATeachingPrelims HighMains HighStatic GK Link
29 Jul 2026
~2 min
Source: Indian Express
Key Data:₹1.27 lakh crore6 years40% silicon fab subsidy35% advanced packaging25% conventional packaging75% R&D incentive
Bodies:Union CabinetMinistry of Electronics & IT (MeitY)Tata ElectronicsMicron TechnologyPowerchip Semiconductor Manufacturing Corporation (PSMC)Kaynes SemiconCG SemiIndia Electronics and Semiconductor Association (IESA)
Practice MCQs from today's news ▸
What This Article Covers

1.Cabinet approves India Semiconductor Mission 2.0 with ₹1.27 lakh crore outlay for six years, expanding beyond fabrication to include equipment, materials, chemicals, R&D, design, and talent development.

2.Incentives restructured: silicon fabs get 40% subsidy, advanced packaging 35%, conventional packaging 25% — a reduction from the uniform 50% in ISM 1.0.

3.India aims to design and manufacture chips for 70-75% of domestic applications by 2029 and become a top semiconductor nation by 2035.

The Big Picture
Prelims · HighMains · High

The Union Cabinet has approved India Semiconductor Mission 2.0 with a ₹1.27 lakh crore outlay for six years, shifting from a uniform 50% subsidy to differentiated incentives across the semiconductor value chain. This is a strategic move to build an end-to-end ecosystem—from chip design and fabrication to materials, chemicals, and R&D—reducing reliance on imports and positioning India as a global chip player. Essential for UPSC GS3 (Science & Technology, Economy) and prelims fact-based questions.

Exam Lens

Quick Exam Facts From News

Scheme NameIndia Semiconductor Mission 2.0 (ISM 2.0)
Total Outlay₹1.27 lakh crore
Duration6 years
Silicon Fab Subsidy40%
Other Fab Subsidy35%
Advanced Packaging Subsidy35%
Conventional Packaging Subsidy25%
R&D/Talent Incentive (max)75% with Centre+State
Target 202970-75% domestic chip needs
Target 2035Top semiconductor nation globally
ISM 1.0 Investment Committed₹1.64 lakh crore
Nodal MinistryMinistry of Electronics & IT (MeitY)

1-Minute Revision

  • ›Scheme Name: India Semiconductor Mission 2.0 (ISM 2.0)
  • ›Total Outlay: ₹1.27 lakh crore
  • ›Target this Data: ₹1.27 lakh crore outlay, 6 years, 40% silicon fab subsidy, 35% advanced packaging, 25% conventional packaging, up to 75% R&D incentive.
  • ›Target this Nodal Body: Ministry of Electronics & IT (MeitY), Secretary S Krishnan.
  • ›Target this Scheme: India Semiconductor Mission 2.0 (second iteration, approved July 2026).

Mastered this topic? Test your knowledge with a full MCQ quiz.

Practice exam-style questions, track your score, and strengthen your recall.

Q1Static LinkageEasy

Which ministry is primarily responsible for implementing the India Semiconductor Mission (ISM) schemes?

Q2Statement-basedHard

Consider the following statements regarding India Semiconductor Mission (ISM) 2.0:

1. The Union Cabinet approved ISM 2.0 with an outlay of Rs 1.27 lakh crore for a duration of six years.

2. Under ISM 2.0, a uniform capital subsidy of 50% is provided for all types of semiconductor fabs and packaging plants.

3. The scheme expands support to include semiconductor equipment, materials, chemicals, R&D, and talent development.

Which of the statements given above is/are correct?

Q3Data-centricMedium

Under India Semiconductor Mission 2.0, what is the capital subsidy provided for silicon fabrication plants?

Q4Application/ImpactMedium

What is the primary strategic objective behind India Semiconductor Mission 2.0?

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